3.2 mm x 5 mm ceramic package smd tcxo i533/i534/i733/i734 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 12/20/11_d specifications subject to change without notice page 1 5.0 2.6 1.4 1.35 1.6 4.0 dimension units: mm 1 2 4 3 pin connection 1 control voltage or n.c. 2 gnd 3 output 4 vcc 3.2 1 2 2 3 3 4 4 1 1.5 2.5 product features: applications: low jitter, non-pll based output server & storage available in both clipped sinewave and sonet /sdh hcmos output levels 802.11 / wifi compatible with leadfree processing t1/e1, t3/e3 fibre channel note: a 0.01 f bypass capacitor is recommended between vcc (p in 4) and gnd (pin 2) to minimize power supply noise. ** not available for all temperature ranges. frequency 8.000 mhz to 40 mhz output level clipped sinewave hcmos 0.8 v p-p min. ?0?=0.5 vdc max., ?1?=0.8vcc min. output load clipped sinewave hcmos 20k ohms / 10 pf 15pf duty cycle (hcmos) 50% 10% rise / fall time (hcmos) 10 ns max. frequency stability vs temperature vs voltage vs load(5%) see frequency stability table ? 0.3 ppm max. ? .0.2 ppm max. frequency tolerance @ 25 ? c ? 1.0 ppm aging ? 1 ppm / year max. supply voltage see supply voltage table , tolerance ? current 2.0 ma max. (clipped sinewave) 6.0 ma max. (hcmos) voltage control (i733/i734) 1.5 vdc ? 1.0 vdc, ? 5.0 ppm min. operating see operating temperature table storage -40 ? c to +85 ? c phase noise (typ. @ 20mhz) -86 dbc/hz @ 10 hz -115 dbc/hz @ 100 hz -138 dbc/hz @ 1khz -146 dbc/hz @ 10 khz part number guide sample part number: i537-1q3-20.000 mhz package operating temperature frequencystabilit y vs temperature supply voltage frequency i533 (clipped sinewave tcxo) i534 (hcmos tcxo) i733 (clipped sinewave tcvcxo) i734 (hcmos tcvcxo) 7 = 0 ? c to +50 ? c **n = ? 1.0 ppm 3 = 3.3 v - 20.000 mhz 1 = 0 ? c to +70 ? c **o = ? 1.5 ppm 7 = 3.0 v 3 = -20 ? c to +70 ? c **p = ? 2.0 ppm 2 = 2.7 v 2 = -40 ? c to +85 ? c q = ? 2.5 ppm r = ? 3.0 ppm j = ? 5.0 ppm
3.2 mm x 5 mm ceramic package smd tcxo i533/i534/i733/i734 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 12/20/11_d specifications subject to change without notice page 2 pb free solder reflow profile: typical application: *units are backward compatible with 240c reflow processes package information: msl = n.a. (package does not contain plastic, storage life is unlimited under normal room conditions). termination = e4 (au over ni over w base metalization). tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: i - date code (yww) line 2: frequency quantity per reel 1000 a 8 +/-.3 b 4 +/-.2 c 3.5 +/-.2 d 9 +/-1 or 12 +/-3 e 60 / 80 f 180
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